JEFF PUNCH BEng PhD MASME CEng MIEI
Director

e: jeff.punch@ul.ie

t: +353-61-213004

Dr. Jeff Punch is the Director of the Stokes Institute, collaborating with the Institute’s partners and clients on a range of research programmes. He is also Assistant Director of the CTVR Telecommunications Centre, an SFI-funded multi-university research programme in collaboration with Bell Laboratories. In addition, he has managed a research partnership between UL and the Nokia Corporation from 2000 to date. He has wide-ranging research interests in the analysis of micro-scale mechanical engineering phenomena within the application arenas of electronic and micro-electromechanical systems – with particular emphasis on thermal / energy management and reliability physics. He has a strong record in attracting industrial and research funding, and he has supervised ten graduate students to completion (10 PhD, 1 MSc) over the past five years. He is currently supervising three PhD scholars and mentoring four postdoctoral researchers. He has authored or co-authored over 100 refereed publications and five patents, and has presented more than 50 invited talks on aspects of the thermal management and reliability of electronic systems at venues in Europe, USA, the Middle East, India and Asia-Pacific.

Education: BEng in Mechanical Engineering, and a PhD from UL.

Research interests: Thermal energy management and reliability physics challenges in electronic / photonic devices and systems; lead-free solder; energy harvesting

Sample publications:

Herkommer, D., Punch, J. and Reid, M., “Constitutive Modelling of Joint-Scale SAC Solder Shear Samples”, accepted for publication in IEEE Transactions on Components and Packaging Technologies.

Kelly, G., Punch, J., Goyal, S. and Sheehy, M., 2010, “Shock Pulse Shaping in a Small Form Factor Velocity Amplifier”, Shock and Vibration, published online, July, doi: 10.3233/SAV-2010-0521.

Kim, K.J., Cottone, F., Goyal, S. and Punch, J., 2010, “Energy Scavenging for Energy Efficiency in Networks & Applications”, Bell Labs Technical Journal, Vol. 15, Iss. 2, pp. 7-29.

Jeffers, N., Punch, J. and Walsh, E., 2010, “Temperature Distribution on an Isoflux Surface Cooled by an Impinging Liquid Jet with a 40º Wall Jet Swirl Generator”, Journal of Visualization, Vol. 13, No. 3, pp. 177-178.

Herkommer, D., Punch, J. and Reid, M., 2010, “A Reliability Model for SAC Solder Covering Isothermal Mechanical Cycling and Thermal Cycling Conditions”, Microelectronics Reliability, Vol. 50, Iss. 1, January, pp. 116-126.

Kearney, D., Punch, J. and Grimes, R., 2009, “An Experimental Investigation of the Flow Fields within Geometrically-Similar Miniature-Scale Centrifugal Pumps”, ASME Journal of Fluids Engineering, Vol. 131, Iss. 10, Oct, pp. 101101.1-10.

Jeffers, N.M.R., Punch, J., Walsh, E. and McLean, M., 2009, Heat Transfer from Novel Target Surface Structures to a Normally-Impinging, Submerged and Confined Water Jet”, ASME Journal of Thermal Science and Heat Transfer Applications., Vol. 1, Sep, pp. 031001.1-9.

Herkommer, D., Reid, M. and Punch, J., 2009, “In-Situ Optical Creep Observation of Joint-Scale SAC Solder Shear Samples”, Journal of Electronic Materials, Vol. 38, No. 10, pp. 2085-2095.

Sheehy, M., Punch, J., Goyal, S., Reid, M., Lishchynska, M. and Kelly, G., 2009, “The Failure Mechanisms of Micro-scale Cantilevers under Shock and Vibration Stimuli”, Strain, 45(3), pp. 283-294.

Reid, M., Punch, J., Collins, M. and Ryan, C., 2008, “Effect of Ag Content on the Microstructural Characteristics of Sn-Ag-Cu Based Solder Alloys”, Journal of Soldering and Surface Mount Technology, Vol. 20, No. 4, pp. 3-8.