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The Institute has ten years experience in the characterisation of state-of-the-art component packages, conducting tests and analysis for a range of semiconductor manufacturers in Ireland and the UK. A broad range of packages have been addressed to date: DIP, PLCC, PowerQuad, TQFP, PQFP, SOP, TSOP, LCCC, SmartPack, BGA and SuperBGA. |
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Characterisation of a heat sink for a PC processor was carried out for the Irish facility of an multinational computer manufacturer. Thermal performance of an alternative heat sink was evaluated, and it was found to compare favourably with the existing part. The alternative part represented considerable cost savings. |
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