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The Stokes Institute has a substantial research effort addressing
a range of topics in micromechanical engineering. There are three predominant themes: reliability physics , microsystems for energy management and aerodynamic instrumentation.
| RELIABILITY PHYSICS |
The Institute has over fifteen years' experience in research addressing the
reliability of electronic hardware, with particular strengths in:
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 Thermo-Mechanical Analysis of Interconnection and Packaging |
| Thermal Management of Electronic Systems |
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| Design for Shock, Impact and Vibration |
| Design for Humidity and Corrosion |
| Failure Analysis |
| Accelerated Environmental Testing |
| Reliability Analysis |
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Lead-Free |
A comprehensive suite of facilities is available for controlled environmental exposures, materials characterisation, failure analysis, simulation, reliability data analysis, and the measurement of quantities such as temperature, pressure, airflow, concentration, acceleration and strain.
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