The Electronic Reliability Laboratory at the SRI offer expert solutions to the electronics, photonics, and manufacturing industries. SRI expertise in optical microscopy, electron microscopy, materials and failure analysis techniques and reliability testing allows us to identifying a wide range of failure mechanisms (poor plating, ionic migration, corrosion related failures, solder joint fatigue, etc.). Failure analysis is designed to “identify the failure modes” by identifying the failure site, the failure mechanism, determine the root cause and finally recommend failure prevention approach. Typically the failure analysis begins with the most non-destructive techniques and then proceeds to the more destructive techniques, allowing the gathering of unique data from each technique throughout the process. This data when properly analysed leads to a viable mechanism for the failure.

Secondary electron image of copper sulfide (Cu2S) on pure coupon exposed to corrosive environment.	Focused ion beam cross-section of electrical contact exposed to corrosive environment.
EDS spectrum of migration residue on printed wiring board after cyclic temperature and humidity exposure.