Research on thermal management at the SRI has covered all structural levels of electronic systems:

System-level: optimisation of fans and heat sinks, including acoustic noise minimisation

Module-level: thermal behaviour of circuit boards and substrates; applications of heat pipes and thermoelectric cells

Component-level: package characterisation; microchannel cooling for packages and die

Are you an engineer or manager with responsibility for the design of electronic hardware, considering an investment in thermal analysis software? Check out the Stokes Research Institute's Evaluation Questionnaire.

This questionnaire highlights a range of issues - customer support and technical - to assist you in your evaluation of thermal analysis software for electronics.

View the Questionnaire in Adobe Acrobat PDF format.