The theme of this project is an investigation of small-scale thermoacoustic cooling modules for the thermal management of electronic devices. Integration of microelectronics continues to drive higher power densities, and heat removal has become a critical limitation on the development of information and communication technologies. In this regard, thermoacoustic modules offer advantages over conventional convection cooling or heat pumping techniques such as thermoelectrics and refrigeration. In particular, thermoacoustic modules feature low power consumption because their relative effectiveness is approximately twice that of thermoelectric devices. Moreover, they obviate the environmental threat associated with refrigerant fluids. Finally, the simplicity of their structure offers the potential for low cost manufacture and high reliability.

Heat Exchanger for Meso-Scale Thermoacoustic Module, with Close-Up

The objective of the research is to design, fabricate and characterise a meso-scale thermoacoustic module suitable for the thermal management of microelectronics. The methodology of the investigation is primarily experimental, initially addressing a meso-scale configuration, progressing to consider the feasibility of a smaller-scale device with micro-scale features. The outcome of the research will be the demonstration of a meso-scale thermoacoustic module, with an understanding of its operation, and the identification of avenues for further miniaturisation.

This research is being conducted in collaboration with acoustician Dr Pierrick Lotton of Laboratoire d'Acoustique de l'Université du Maine (LAUM).